Overview
CRUMPATT | Spatial Signature Analysis
TARGOSS™ SPATIAL SIGNATURE ANALYSIS analyses defect inspection data and identifies spatial defect signatures. These can result from process- respectively machine-problems which produce single defects, scratches, circles or other defect clusters as singular or repetitive defects on the wafer or in the exposure field.
TARGOSS™ SPATIAL SIGNATURE ANALYSIS identifies these signatures and is able to classify them. Thus TARGOSS™ SPATIAL SIGNATURE ANALYSIS automates the defect analysis and is an indispensable and reliable tool in a yield management system.
TARGOSS™ SPATIAL SIGNATURE ANALYSIS allows to detect process and equipment problems automatically and timely and secures a high yield. In addition, decisions for maintenance tasks can be actively implemented. Thus periodically arising PM's (sometimes too early, sometimes too late) can be avoided.
TARGOSS™ SPATIAL SIGNATURE ANALYSIS applies self-tuning algorithms.
- Unique multi engine concept
- Comprehensive set of built-in local and global signatures
- Superior noise and image discrimination
- Artificial intelligence (AI) and fuzzy logic to handle noise and variation
- Substrate/defect visualization and complex data query
- Easy to use, straighforward draw and click interface
- Optional manual definition or learn mode of defect signature
- Engineering search and fully automatic production mode with warning capability
- Auto tuning opportunity
- Full inspection history capability
- Option for off-line data analysis
